Novel COB packaging structure

新型cob封装结构

Abstract

The utility model discloses a new construction COB packaging structure, include from last solder mask, conducting wire layer, heat -conduction insulation layer and the panel that sets gradually extremely down, all be equipped with the dead zone of putting that the position corresponds on solder mask, conducting wire layer and the heat -conduction insulation layer, and the projection of solder mask on panel be located the projection the inside of conducting wire layer on panel, panel and heat -conduction insulation layer put the top surface that the dead zone position corresponds on be equipped with the reflection white glues, reflect and be equipped with a plurality of LED chip on the white glues, through adherent wire electric connection between the LED chip, and pass through adherent wire and conducting wire layer electric connection near the LED chip on conducting wire layer. The utility model has the advantages of direct coating reflection white glues on panel, and the LED chip is located reflection white glues top, having improved the heat dissipation and having reduced the light decay, and having chooseed for use reflection white glues panel can choose the lower aluminium scutum material of cost for use, and simple process saves the cost.
本实用新型公开了新结构COB封装结构,包括从上至下依次设置的阻焊层、导电线路层、导热绝缘层和板材,所述阻焊层、导电线路层和导热绝缘层上均设有位置对应的置空区,且阻焊层在板材上的投影位于导电线路层在板材上的投影里面,板材与导热绝缘层的置空区位置对应的顶面上设有反射白胶,反射白胶上设有若干个LED芯片;LED芯片之间通过焊接线电性连接,且靠近导电线路层的LED芯片通过焊接线和导电线路层电性连接。本实用新型的优点在于在板材上直接涂覆反射白胶,且LED芯片位于反射白胶上方,提高了散热减少了光衰,且选用反射白胶板材可以选用成本较低的铝质板材,工艺简单节省成本。

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